Can be integrated with the production line: gantry structure and flying light path design,easy to connect to the production line, can be equipped with special loading and unloading and IN-LINE systems according to production requirements, realize full automation of production, and greatly improve production efficiency. It is designed for FPC and PCB processing Tailor-made equipment.
Efficient and fast FPC/PCB exterior cutting, drilling and cover film windowing,fingerprint recognition chip cutting, TF memory card splitting, mobile phone camera module cutting and other applications.
Divided, layered, designated block or selected area is cut and formed directly, the cutting edge is neat and round, smooth, without burrs, and without glue overflow.The products can be arranged in a matrix for automatic positioning and cutting,which is especially suitable for the cutting of fine, difficult, and complex patterns.
High-performance laser: Adopting the solid-state UV laser of the international first-line brand, it has the advantages of good beam quality, small focus spot, uniform power distribution, small thermal effect, small slit width, high cutting quality, etc. It is the
guarantee of perfect cutting quality.
Fast and high precision: The combination of a high-precision, low-drift galvanometer and a fast iron-core linear motor system platform enables fast cutting while maintaining micron-level high precision.
Fully automatic positioning: The high-precision CCD is used for automaticpositioning and focusing, so that the positioning is fast, accurate and high-precision, without manual intervention, simple operation, realizes the same type of one-key mode, and greatly improves production efficiency.
Exhaust gas treatment system: The suction system can eliminate all cutting exhaust gas, avoiding the harm to the operator and the pollution to the environment.
High degree of automation: the scanner auto-calibration, auto-focusing, the whole process of automation, the use of laser displacement sensor automatically adjusts the height of the focus to the table, to achieve rapid alignment, saving time and worry.
Easy to learn software: self-developed Windows-based control software, easy-to-use Chinese interface, friendly and beautiful, powerful and diverse, easy to operate.
| Item | Device Model | YSV-7A |
| | Laser Brand | Optowave/United States |
| | Laser Power | 15W |
| | Laser Properties | All solid-state UV laser |
| | Laser Wavelength | 355nm |
| | Galvanometer | SCANLAB/CTI Germany |
| | Field Lens | SILL/JENOPTIK Germany |
| | Guide | HIWIN/Taiwan |
| | Reflector | United States(Optowave) |
| | Grating Ruler | Renishaw/United States |
| | CCD | MVC/Italy |
| Accessories Configuration | Driver | Yaskawa / Japan |
| | Reflector | Optowave/United States |
| | Linear motor | igus/Shanghai ECHU |
| | 355 Beam Expander | Optowave/United States |
| | Linear Motor | HIWIN/Taiwan |
| | 355 Beam Expander | United States(Optowave) |
| | Dust Processor | HOYAN |
| | Equipment Body | Marble/Qingdao |
| | Motion control card | Trinidad Cloud/Shenzhen, China |
| | Cutting Software | Hoyan-ScanCut |
| | Spot Diameter | 20± 5um |
| | Maximum Scanning Range of Galvanometer | 50mm*50mm |
Performance configuration | Cutting Substrate Thickness | Less than 1.2mm (Depending on the cutting quality of different materials) |
| | Repeatability | ±2 μm |
| | Positioning Accuracy | ±2 μm |
| | Machining Accuracy | ±20 μm |
| | |
| | Equipment Size | 1350mm(L)×1150mm(W)×1550mm(H) |
| | Support document format | Gerber/DXF |
| | Equipment Weight | 1500KG |
| | Largest format | 460*460MM |
Environmental Requirements | Power Supply | AC220V / 3.5KW |
| | Grid Demand | (Two-phase) single-phase AC220V |
| | Temperature | 20±2 ℃ |
| | Humidity | 50-60% no condensation |
| | Air pressure requirement | 0.5~0.6Mpa(No need for stand-alone) |
| | Shock | ≤5um |
Other
Environmental requirements:20±2 ℃ /50-60% No condensation
Special function:Laser QR code (metal/white oil surface);There is reserved space to change the automation equipment later
